Louder-ESP32 Speaker CAB

Louder-ESP32S3 Smart Speaker

ESP32-S3 + TAS5805M + Passive Radiators + TCP115 + DC28FT

This project is a fully 3D-printed smart speaker designed around the Louder ESP32-S3 audio board (with built-in TAS5805M DSP power amplifier).
It delivers wide dispersion, strong bass for its size, and a clean, modern aesthetic inspired by smart speakers such as the HomePod.

The enclosure is engineered for high stiffness, low resonance, and controlled airflow, supporting either active DSP or passive crossover operation.

Enclosure & Dimensions

• Internal volume: ~5–6 L

• External size: 190 × 190 × 240 mm

• Wall thickness: 5 mm

• Rounded outer edges: R20 mm

• Material: PLA+

• Print orientation: top-down

Fabric wrap system

• Fabric wrap: removable sleeve

• Fabric cage: 3D-printed lamella-style outer cage providing structural support and clean fabric tension

• Retention method: top and bottom clamp rings lock fabric sleeve in place

• Serviceability: fabric can be removed without opening the enclosure

Drivers

Woofer

• Dayton TCP115-4 (4" mid-bass)

Tweeter

• Dayton DC28FT-8 (1-1/8" dome, truncated faceplate)

• Mounted above woofer for vertical 2-way alignment

Passive Radiators

• 2× Dayton DMA105-PR

• Mounted left/right for symmetric bass loading and reduced cabinet rocking

Internal Structure

To achieve a rigid, low-resonance enclosure:

• Vertical spine: front-to-back brace to control cabinet “breathing” modes

• PR strap brace: ties left/right walls at PR height

• Top/back ribs: 3–3.5 mm thick to suppress panel resonance

• Radial PR ribs: 5–6 spokes around each PR to distribute reaction forces

• Driver doublers: reinforcement behind woofer, tweeter, and PR cutouts

• Corner fillets throughout: improved strength, airflow, and print reliability

Electronics (Louder32 ESP32-S3)

• ESP32-S3 Wi-Fi streaming or Ethernet with W5500

• TAS5805M 2× digital-input Class-D amplifier

• Mounted on rear wall using four M3 standoffs

Compatible with:

• Snapcast

• Squeezelite-ESP32

• ESPHome

Printing Guidelines

• Walls: 5 perimeters

• Top/bottom: 5 solid layers

Infill:

• Enclosure: 12–15% Gyroid or Adaptive Cubic

• Baffle + PR regions: 25–40% (modifier recommended)

DSP / Audio Tuning

Two supported paths:

Active DSP (recommended)

TAS5805M configuration:

• LR4 crossover @ 2.6–2.8 kHz

• Woofer shaping EQ

• Tweeter EQ + level trim

• PR subsonic high-pass (~30 Hz)

• Optional limiters for protection

Passive Crossover (simpler option)

If DSP is not used:

• 2.5–3.0 kHz LR2 network

• L-pad for tweeter level matching

• Air-core inductors + film capacitors

Stuffing & Damping

Recommended internal damping:

• Polyfill / polyester fiberfill

• Light to moderate amount (~20 g total)

• Keep back of PR zones free

BOM

• M3 heatset inserts

• M2 heatset inserts 2mm H x 3.5 OD

• M3 Bolts

• M3 Screws - Top Lid

• M2 4mm screws

• Speaker Cloth

• Soundproofing gasket

Tips

Use the gasket around the Ethernet port to create a snug, airtight seal. Allow the gasket to slightly overlap the enclosure opening, then press the port firmly into place. Secure using two M3 bolts.
⚠ Do not overtighten, as this may flex or damage the PCB.

When installing the fabric wrap, fasten the cage by driving the screws directly through the fabric between the cage and the clamp rings. Pull the fabric taut and evenly before tightening the screws to ensure a clean finish.

When sliding the fabric and cage assembly over the main enclosure, take care not to snag or press against the drivers—the internal clearances are tight around the speaker frames. The top lid screws down to secure everything in place.

I have been using a 19v 4.74a PSU with this and it has been rock solid with no issues.

Excuse the F3d file, not the tidest :) I am not a modeller ha!