120mm Fan Case for Odroid H5
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Case with side-airflow for the Odroid H5
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While the stock ODROID-H5 Case Type1 worked fine and kept temperatures under control, I wanted more airflow for the SSDs and use a larger fan that is large enough to stay quiet even under load.
DISCLAIMER: Photos show v1 with manually enlarged port cutouts. Uploaded model already has fixed port cutouts.
Printing
Print at least in PETG or another heat resistant filament, since PLA will deform over time.
Optional: Power/Reset buttons & cutout
A separate bottom shell with a side cutout for the power/reset button is included. Note: the cutout sits in the fan's high-pressure zone right in front of the heatsink, so it leaks airflow and slightly reduces cooling performance. I run my unit with auto-power-on enabled and therefore use the closed shell without the cutout. Only print the cutout version if you actually need physical button access. The power button (ODROID-H5 GPIO pin 17 to GND) can be wired to a momentary switch in the top shell. Add a cutout yourself with a simple modifier/boolean in your slicer or CAD to match your switch. Keeps the airflow-critical side walls closed.
Bottom Shell
Print as designed, use supports for the port cutouts
Fan Duct
Print standing on the fan intake
Use support for the port cutout
Endplate
Set slicer to 0 top/bottom layers, 4 perimeters
Play with infill to get the desired look.
Example used
10% Hex infill
30° infill angle
Print Time - Rough, Prusa MK3.5
Bottom Shell: 4h 20min
Fan Duct: 5h
Endplate: 15m
Hardware needed
120mm Fan. Pictured: Arctic P12 Max
Heat Set inserts
12x M3x3 (optionally, add 4 for TPU feet)
4x M4x4
Screws
12x M3x8
4x M4x10
Optional: 4x M3x6 for TPU feet
Temperature Comparison
All values measured at idle under normal operation (Home Assistant and background services), both cases at the same room temperature. Absolute numbers will be higher under sustained load, but the relative improvement should hold.
Measurement | Before | After | Δ |
|---|---|---|---|
CPU Package | 50.0°C | 41.0°C | -9.0 |
M2_SSD2 (Top) | 46.9°C | 39.9°C | -7.0 |
M2_SSD3 (Bottom) | 45.9°C | 36.9°C | -9.0 |
M2_SSD4 (Bottom) | 54.9°C | 39.9°C | -15.0 |
Realtek RTL8127 10GbE | 49.0°C | 44.0°C | -5.0 |
Overall good, but I'm especially happy about the -15°C less on M2_SSD4, since that's populated by a KIOXIA BG5 DRAM-less 2230 SSD for data storage.
Air Path Comparison
Stock Case
Incoming air is heated by the CPU before part of the air flows around the board and out the bottom.
New Case
Top: SSDs get cold air before it's heated by the CPU
Bottom: Direct air intake for RAM/SSDs
