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Gridfinity stackable foam bed for electronic componets — zdjęcie 1
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Gridfinity stackable foam bed for electronic componets

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These gridfinity blocks can be stacked on top of themselves and hold foam where chips and electronics can pressed into

Ocena
4 / 5
Polubienia
7
Pobrania
31
Wydruki
1
Wyświetlenia
590
Oceny
1

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Informacje o modelu

Źródło
Printables
Kategoria
Organizers
Licencja
Creative Commons — Attribution

#gridfinity 

This is a quick remix of one of my prior models for a commenter who suggested a stackable element should be added to the TO220 packaged component holder. This variant adds a set of holders that dont need any support structure that allow for blocks to be stacked on top of each other, while still seeing what components are underneath

I made a version that also holds a foam block which can be cut and friction fitted into the gridfinity block, allowing for DIP chips or varying size or full on micro controllers to be stored just as easily.

Tagi