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Bondtech BMG MK3S and MK3 DissEd — zdjęcie 1
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Bondtech BMG MK3S and MK3 DissEd

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MK3S extruder body adapted to fit bmg and both mk3 and mk3s sensors.

Ocena
5 / 5
Polubienia
33
Pobrania
300
Wydruki
1
Wyświetlenia
3014
Oceny
2

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Informacje o modelu

Źródło
Printables
Licencja
Creative Commons — Attribution — Noncommercial — Share Alike

MK3S extruder body adapted to fit bmg and both mk3 and mk3s sensors. No need to reprint the body if you want to change to mk3s IR sensor.

The IR sensor module is an adaptation of bondtech solution for their mk3 bondtech upgrade. I haven't, and can't, test it, but It should work just as well as theirs. The module for the laser sensor works perfectly and is the one I am using right now.

I did this extruder version to stay up to date with the extruder body and since I haven't decided on moving to the new sensor It gives me the chance of doing it pretty easy in the future.

**This Extruder version will only work with a pancake stepper

Print instructions

The assembly process is more or less the same as prusa's mk3s extruder body, so I recommend following their instruccions.

1- Install PINDA sensor in first place.
2- Then BMG+E3D+Pancake.
3- Extruder cover.
4- X-carriege
5- Noctua
6- Filament sensor module.
7- fan shroud and fan holder.
and follow prusa documentation.

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