Silicon Wafer Curing Tool
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Print with temperature resistant materials. This tool needs to withstand temperatures ~80°C. Depending on the model,…
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- Printables
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- Creative Commons — Attribution — Noncommercial
Print with temperature resistant materials. This tool needs to withstand temperatures ~80°C. Depending on the model, you may need M6 screws and nuts OR magnets. You can use the tray models to collect the leakage. Usually, the leakage is negligible.
Before curing:
Assemble the device, add the PDMS, degas and incubate at ~85°C.
After curing:
If you are using the tray, carefully peel off the tray from the bottom.
If you are using screws and bolts, remove those first.
Carefully, peel off the wall(s) from the ground plate.
Carefully, insert a blade between silicon wafer and the ground plate and cut around the sides up to 2-3cm deep. This should make is easy to detach the wafer from the ground plate by hand without breaking it.
Then you can peel off the PDMS from the wafer.
Print Settings
Printer Brand:
Prusa
Printer:
I3 MK3S
Rafts:
No
Supports:
No
Resolution:
200
Infill:
20
Filament: GreenTec Pro PLA White Post-Printing =============
Optional
To reduce leakage, I highly suggest to smear aquarium silicone (not hot glue, as many of them get softer are 80°C) to the ground plate at the contact surfaces with the walls and smear a thin coating of soap on the walls (contact surfaces). This will prevent silicone sticking to the walls. Assemble the device and remove excess silicone! Cure the silicone in this state. Later on disassemble the device to check for holes and gaps. You can repeat the process if you want. Similarly, you can trap magnets in the round holes with such a silicone. This will hold 2 pieces together while trapping the ground plate in between.
I used FreeCAD to design this with a parametric approach. The dimensions can be adjusted. For me the interesting part was to add text to curved surfaces.
Category: Machine Tools