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Flipper Zero WiFi Developer Case (Wi-Fi, WLAN) RMX
Material: PLA Layer Height: 0.20 mm Infill Density: 30% Wall Thickness: 1.5 mm Wall line count: 3 Build Plate Adhesion Type: Skirt No supports
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Material: PLA Layer Height: 0.20 mm Infill Density: 30% Wall Thickness: 1.5 mm Wall line count: 3 Build Plate Adhesion Type: Skirt No supports
Material: PLA Layer Height: 0.20 mm Infill Density: 20% Wall Thickness: 1.5 mm Build Plate Adhesion Type: Skirt Support Type: Normal Support Placement: Everywhere Model Structure Type: Normal
Material: PLA Layer Height: 0.25 mm Infill Density: 25% Wall Thickness: 2 mm Build Plate Adhesion Type: Skirt Support Type: Normal Support Placement: Everywhere Model Structure Type: Normal
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