Framework 16 Mainboard Case - Full and Split Versions
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Fixed the official Framework 16 mainboard case to prevent expansion card sag.
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Informacje o modelu
- Źródło
- Printables
- Kategoria
- Computers
- Licencja
- Creative Commons — Attribution
I printed the official framework 16 mainboard case and found that the design was lacking in support for the expansion cards, resulting in the cards sagging and stressing the USBC port. You will need to print 5 connector pins to join the top/bottom of the case, but I recommend printing a few extra just in case.
You will need an RTC battery from Framework to get this to boot out of the laptop chassis: https://frame.work/products/16-rtc-battery-cable
Only print this in ABS, ASA, or specialized filaments with high thermal deflection temps. PETG and PLA will melt. The FW16 mainboard gets very hot, CPU throttles at 100C which it will hit under load. I print this in a heated chamber at 100F and scaled up to 100.4% and it works perfectly to compensate for warp/shrinkage, but it would be worth it to calibrate and test your ABS tolerances before committing the time to print the full model since it is large.
This model is just an improved version of the official model on their github, the only parts that I modified is to add support for the expansion cards.
I also made a skeletonized version of the full case for better airflow, same improvements on the expansion card slots there.
Added on a skeletonized version of the split case for a request.
3/31: Updated a few models after feedback from someone about a rough edge on the top right of where the mainboard goes, fits well now