Spacemit K3 CoM260 Case
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Case for the Spacemit K3 CoM260 developer board.
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Case for the Spacemit K3 CoM260 developer board. This has almost the same form factor as the Jetson Orin Nano dev board: the only difference is a larger heatsink on the CoM260.
I recommend printing the main body upside down, with supports only for the 40-pin connector area overhang. Paint on supports targeted at that area will avoid unnecessary auto supports being added to e.g. ventilation grills, but use auto if you don't know how to do that.
Probably best to use PETG or other filaments with higher HDT than PLA, as the device may get warm under full load.
Examples here were printed in translucent red PETG, and PETG-CF.