RG552 custom backplate with offset venting

Modding your device can void your warranty and I won't take any responsability if you cause any damage during the process. Installing this backplate require to detach the battery from the original part to transfer it. It is hard glued and require patience and extra care to not deform or bend the battery cells. Get a professional help if you are not comfortable with these steps. You are on your own !

A custom backplate for the Anbernic RG552 with offset venting.

I realized most of the noises I could hear from the device fan was coming directly from the fan intake which is cut right ontop of said fan.

Inspired by Steam Deck and Switch designs, I moved the intake vents to the bottom of the device, tempering part of the fan noises.

I also replaced the original thermal pad between the RK3399 chip and the heatsink with high efficiency ARCTIC TP-3 thermal pad. I would not recommend changing the backplate without replacing the thermal pad either as it helped a lot keeping the fan low.

I made some tests to compare the noises level. It was measured with a smartphone app, probably not accurate at all but acknowledge some gain.

Original backplate

ambiant noise : 25Db

fan set to Medium : 43Db

fan set to High : 47Db

Offset venting backplate

ambiant noise : 27Db

fan set to Medium : 41Db

fan set to High : 39Db

Best printed in PETG, the RG552 can become hot enough to get PLA to deform.

Some of the little pins that clip onto the device body can break during installation because FDM printing can't bend as good as the original molded plastic, just remove them before closing the device.

The original rubber pads can be transfered to the printed backplate, just peel them gently to preserve the adhesive.