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Bigme Highbreak Pro bumper Case
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Bumper case for the Bigme Highbreak Pro e-ink screen smartphone.
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Model information
- Source
- Printables
- Category
- Other Gadgets
- License
- Creative Commons — Attribution
I printed the case in PLA, with 0.2 mm layer height. The print took about 40 minutes in total. I used my Prusa MK3.9 with ‘0.20mm - STRUCTURAL’ print profile.
I uploaded the OpenScad file for you to thinker with, if you like. You can import the 3MF file directly into your slicer software, though.