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Orange Pi Zero 2W Case — image 1
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Orange Pi Zero 2W Case

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This is an Orange Pi Zero 2W case design meant to allow access to the GPIO pins using standard dupont connectors.

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Updated at source:

Model information

Category
Computers
License
Creative Commons — Attribution — Noncommercial — Share Alike

The current design conforms to all of these requirements:
 

  • Protected GPIO access with dupont cables
  • Lots of ventilation
  • Alternative model with heatsink cutouts
    • The cover without the heatsink cutouts allows for standard low form factor heatsinks meant for sbcs (5.86mm heatsink height).
  • Internal antennae mount
  • magnet install cutouts
  • standard m3 assembly hardware

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MOTIVATIONS:

I needed an Orange PI Zero 2W Case that allows access to the GPIO pins without exposure. I also needed an internal radio antennae mount and an alternative case top that allows for adding a heatsink in case the operational temperature of the memory or the processor exceeds safe operation thresholds. I also needed slots to allow for magnetic mounting of the sbc anywhere magnetic.

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REMIXING AND MODIFICATIONS:

I have included all Solidworks files required to create the file. The models are dimensionally constrained and fully parametric, feel free to go into the equations tab and change values according to your needs.

(The geometry isn't fully parametrically constrained, therefore you may need to modify additional values following the modification of a single element.)
(If you do not have solidworks, I highly recommend OnShape, it is a great alternative with a more modern GitHub-like version control system.)

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Print Settings:

ABS

200 mm/s

0% cooling

0.4mm nozzle

0.2mm layer height

4 walls

5 top layers

5 bottom layers

40% isotropic infill (gyroid used)

 

This is a functional part, therefore high-strength settings have been used (40% infill and 4 walls).

MULTIPLE OVERHANGS!
Cooling and extrusion parameters must be dialed in to allow for these overhangs to be printed properly.

Heat-resistant and creep-resistant material is recommended for this print due to the high temperatures generated by the processor core.

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Post-Printing

 
Assembly Materials: 
  • 2x M3x8mm Bolt
  • 2x M3x16mm Bolt 
  • 2x 8mm x 3mm neodymium magnets

 

2x M3x8mm Bolts are required to hold to board to the bottom of the case. The holes are designed to be cut into by the bolts.

2x M3x16mm Bolts are required to secure the top of the case to the bottom of the case while passing through the remaining two holes of the SBC.

The 2 neodymium magnets are optional and they can be pressfit into the case with some hot glue or held in place by taping over it with some electrical or other plastic rubber tape to increase the coefficient of friction.

 

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