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Honor Magic8 Lite / Honor X9d slim case (PLA, snap-in) — zdjęcie 1
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Honor Magic8 Lite / Honor X9d slim case (PLA, snap-in)

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Slim snap-in PLA back case for Honor Magic8 Lite (same body as Honor X9d). Prints flat, no supports. STL + STEP.

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Printables
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Creative Commons — Attribution — Share Alike

Slim back case for the Honor Magic8 Lite. The Honor X9d has the same body (161.9 x 76.1 x 7.8 mm, same camera island and button layout), so it fits that one too.

Designed for rigid filament (PLA / PETG): the phone snaps in from the front over a 0.8 mm retaining lip with a 45 deg inner chamfer. Side walls 1.6 mm, back 1.6 mm, rim stands 1 mm proud of the screen, rounded back edge. Clearance to the phone is 0.15 mm per side for a snug fit.

Cutouts: round camera opening (57.5 mm, 1.25 mm clearance around the 55 mm ring), one open slot on the right for volume + power keys (nothing under the keys, cut flush with the phone edge), bottom opening for SIM tray + USB-C + speaker, top opening for speaker + mic.

Dimensions were taken from the official orthographic renders of the phone and the fit was tuned on a real Magic8 Lite. Files: STL for printing and STEP (solid B-rep) if you want to tweak clearance, cutouts or add your own details in CAD.

Print settings (Bambu Studio / PrusaSlicer): 0.2 mm layers, 0.4 nozzle, 4 perimeters (walls are solid), 5 top/bottom layers, no supports, no brim needed on textured PEI. The STL is already oriented: back on the bed, opening up. Elephant foot compensation 0.15 mm helps the back edge. Keep cooling on and minimum layer time around 8 s so the thin lip does not warp.

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